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Showing posts with label HPC workloads. Show all posts
Showing posts with label HPC workloads. Show all posts

Thursday, 22 December 2016

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Dell EMC Announces New HPC Services

Tech giant Dell EMC has announced a new collection of high performance computing (HPC) cloud offerings, software and systems to make more HPC services available to enterprises of all sizes, optimize HPC technology innovations, and advance the HPC community.

HPC technologies
"The global HPC market forecast exceeds $30 billion in 2016 for all product and services spending, including servers, software, storage, cloud, and other categories, with continued growth expected at 5.2 percent CAGR through 2020," said Addison Snell, CEO of Intersect360 Research, in a statement. "Bolstered by its combination with EMC, Dell will hold the number-one position in total HPC revenue share heading into 2017."

Democratizing HPC
Among the new products and services is the new HPC System for Life Sciences, which will be available with the PowerEdge C6320p Server (pictured above) by the first quarter 2017. The company said the new life sciences service accelerates results for bioinformatics centers to identify treatments in clinically relevant timeframes while protecting confidential data.

"Highly parallelized computing plays an important role in high performance computing," said Ed Turkel, HPC Strategist at Dell EMC, in the statement. "Compared to serial computing, parallel computing is much better suited for modeling, simulating and understanding complex, real world phenomena. In many cases, serial programs 'waste' potential computing power." The PowerEdge C6320p Server is specifically designed to address this parallel processing environment to drive improved performance and faster big data analysis, Turkel said.

The company also said that it will begin offering new cloud bursting services from Cycle Computing to enable cloud orchestration and management between some of the largest public cloud services, including Azure and AWS. Dell said the service allows customers to more efficiently utilize their on-premises systems while providing access to the resources of the public cloud for HPC needs.

The company will also offer customers the Intel HPC Orchestrator later this quarter to help simplify the installation, management and ongoing maintenance of high-performance computing systems. HPC Orchestrator, which is based on the OpenHPC open source project, can help accelerate enterprises' installations and management.

Optimizing the HPC Porftolio
Dell EMC has been increasingly placing its bets on HPC services, unveiling a portfolio of several new HPC technologies earlier this month. For example, the company introduced its PowerEdge C4130 and R730 servers designed to boost throughput and improve cost savings for HPC and hyperscale data centers to support more deep learning applications and artificial intelligence techniques in technological and scientific fields such as DNA sequencing.

"Dell EMC is uniquely capable of breaking through the barriers of data-centric HPC and navigating new and varied workloads that are converging with big data and cloud," said Jim Ganthier, senior vice president, Validated Solutions and HPC Organization, Dell EMC, in the statement. "We are collaborating with the HPC community, including our customers, to advance and optimize HPC innovations while making these capabilities easily accessible and deployable for organizations and businesses of all sizes."
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Friday, 23 September 2016

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Volkswagen Moves HPC Workloads to Verne Global in Iceland

Today Verne Global announced Volkswagen is moving more than 1 MW of high performance computing applications to the company’s datacenter in Iceland. The company will take advantage of Verne Global’s hybrid data center approach – with variable resiliency and flexible density – to support HPC applications in its continuous quest to develop cutting-edge cars and automotive technology.

Volkswagen Moves HPC Workloads to Verne Global in Iceland
"The hybrid data center solution of Verne Global gives us quick and easy capacity for our High-Performance Computing applications,” says Harald Berg, Head of IT Tools, Network and Data Center in the Volkswagen Group. “We were particularly impressed by the modular design of the data center that allows us to respond to increasing demands in a flexible manner.”

Volkswagen is committed to developing new processes and applications for the modern “digital factory” of today’s automotive industry. As more and more real-life factory operations become virtualized, Volkswagen is utilizing HPC applications for everything from shortening design cycles, traffic optimization, developing and improving the connected car and more.

To drive innovation in its manufacturing process, Volkswagen is taking advantage of Verne Global’s unique, hybrid data center approach. Verne Global is the data center industry’s only developer offering the ability to scale resiliency and density of both of its solutions, powerDIRECT and powerADVANCE. Companies, like Volkswagen, can now have greater flexibility to support their individual computing needs. While both solutions deliver highly optimized data center infrastructure, powerDIRECT enables IT organizations to meet the increasing demand for high and ultra-high density applications. powerADVANCE is a traditional Tier III data center solution with the highest possible specification enterprise-ready data center environment.

"Our expertise delivering data center solutions for discrete manufacturing allow companies such as those in the automotive sector to do more compute for less,” said Jeff Monroe, CEO of Verne Global. “We see our unique offering as the future of data center solutions and a means to support companies, like Volkswagen, as they drive towards innovation, forward-thinking design and operational efficiency.”
          
In this video from the HPC User Forum in Tucson, Jorge L. Balcells from Verne Global presents: Verne Global Datacenters for Forward Thinkers.
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Wednesday, 21 September 2016

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CloudLightning Report Looks at Barriers to HPC in the Cloud

The CloudLightning Project in Europe has published preliminary results from a survey on Barriers to Using HPC in the Cloud.

cloud computing for HPC

"Cloud computing is transforming the utilization and efficiency of IT infrastructures across all sectors. Historically, cloud computing has not been used for high performance computing (HPC) to the same degree as other use cases for a number of reasons. This executive briefing is a preliminary report of a larger study on demand-side barriers and drivers of cloud computing adoption for HPC. A more comprehensive report and analysis will be published later in 2016. From June to August 2016, the CloudLightning project surveyed over 170 HPC discrete end users worldwide in the academic, commercial and government sectors on their HPC use, perceived drivers and barriers to using cloud computing, and uses of cloud computing for HPC."

cloud computing for HPC workloads

As shown in Figure 2, trust in cloud computing would appear to be a significant barrier to adopting cloud computing for HPC workloads. Data management concerns dominate the responses. This is not surprising given the large number of bio-science and university and academic respondents within the sample. The main technical barriers relate to communication speeds. This reflects a perceived lack of cloud infrastructure capable of meeting the communications and I/O requirements of high-end technical computing. Government policy is again ranked low it would seem it is neither a driver nor a barrier. Unsurprisingly availability and capital expenditure are not barriers reflecting their positive impact on adoption.

According to the report, there is unlikely to be a full shift of high performance computing workloads to the cloud in the short term however there is evidence of demand to meet the capacity limitations of internal infrastructures including use cases for testing the viability of the cloud or specific software for various use cases. This is consistent with previous research.

"Funded by the European Commission’s Horizon 2020 Program for Research and Innovation, CloudLightning brings together eight project partners from five countries across Europe. The project proposes to create a new way of provisioning heterogeneous cloud resources to deliver services, specified by the user, using a bespoke service description language. Our goal is to address energy inefficiencies particularly in the use of resources and consequently to deliver savings to the cloud provider and the cloud consumer in terms of reduced power consumption and improved service delivery, with hyperscale systems particularly in mind."


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TYAN HPC Platforms Add Support for NVIDIA Tesla P100, P40 and P4 GPUs

TAIPEI, Taiwan, Sept. 21 — TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC Computing Technology Corporation, announces support and availability of the NVIDIA Tesla P100, P40 and P4 GPU accelerators with the new NVIDIA Pascal architecture. Incorporating NVIDIA’s state-of-the-art technologies allows TYAN to offer the exceptional performance and data-intensive applications features to HPC users.

HPC Platforms Add Support for NVIDIA

“Real-time, intelligent applications are transforming our world, thus our customers need an efficient compute platform to deliver responsive and cost-effective AI,” said Danny Hsu, Vice President of MiTAC Computing Technology Corporation’s TYAN Business Unit. “TYAN is pleased to work with NVIDIA to market FT77C-B7079 and TA80-B7071 servers with P100, P40 and P4 to market. The TYAN NVIDIA-based server platforms allow hyper-scale customers to deploy accurate, responsive AI solutions, and to reduce inference latency up to 45x. The high throughput and best in class efficiency of Pascal GPUs make it possible to process exploding volumes of data to offer cost effective, accurate AI applications.”

“The NVIDIA Pascal architecture is the computing engine for modern data centers. Powered by Pascal, Tesla GPUs offer massive leaps in performance and efficiency required by the ever increasing demand of AI applications,” said Roy Kim, Tesla Product Lead at NVIDIA. “We’re partnering with TYAN to deliver the accelerated solutions customers need to deploy HPC applications and AI services.”

TYAN HPC platforms with support for NVIDIA Tesla P100, P40, P4

4U/8 GPGPU FT77C-B7079 – Support up to 2x Intel Xeon E5-2600 v3/v4 (Broadwell-EP) processors, 24x DDR4 DIMM slots, 1x PCI-E x8 mezzanine slot for high-speed I/O option, 10x 3.5″/2.5″ hot-swap SATA 6Gb/s HDDs/SSDs, dual-port 10GbE/GbE LOM, and (2+1) 3,200W redundant power supplies with 80-Plus Platinum rated.

2U/4 GPGPU TA80-B7071 – Support up to 2x Intel Xeon E5-2600 v3/v4 (Broadwell-EP) processors, 16x DDR4 DIMM slots, 1x PCI-E x8 slot for high-speed I/O option, 8x 2.5″ hot-swap SAS or SATA 6Gb/s plus 2x 2.5″ internal SATA 6Gb/s HDDs/SSDs, dual-port 10GbE/GbE LOM, and (1+1) 1,600W redundant power supplies with 80-Plus Platinum rated.

About TYAN
TYAN, a leading server brand of MiTAC Computing Technology Corporation under the MiTAC Holdings Corporation (TSE:3706), designs, manufactures and markets advanced x86 and x86-64 server/workstation board and system products. The products are sold to OEMs, VARs, System Integrators and Resellers worldwide for a wide range of applications. TYAN enable customers to be technology leaders by providing scalable, highly-integrated and reliable products such as appliances for cloud service providers (CSP) and high-performance computing and server/workstation used in CAD, DCC, E&P and HPC markets. For more information, visit MiTAC Holdings Corporation’s website at http://www.mic-holdings.com  or TYAN’s website at http://www.tyan.com
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Sunday, 18 September 2016

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Intel's new PC, IoT chief brings fresh ideas to the veteran chip maker

Intel's second-in-command Venkata Renduchintala is feeling at home with his new company after he switched over from Qualcomm
IoT chief brings
 Venkata Renduchintala is president of Intel's Client and Internet of Things (IoT) businesses and Systems Architecture Group.

Intel is now more than just a PC company. At industry events, the company's keynotes feature drones flying around, robots walking on stage and musicians creating tunes from wearables. The chip maker is helping BMW build an autonomous car, will sell modems to Apple, and is leading the development of next-generation 5G cellular networks. For all these new markets, it will provide chip and data-center technologies.

The transformation is happening partly under the leadership of Venkata Renduchintala, president of the Client and Internet of Things (IoT) Businesses and Systems Architecture Group at Intel. As Intel's second-in-command, he helped cut struggling products like mobile CPUs and sharpened the company's focus on IoT, servers, and connectivity.

Hired from rival Qualcomm late last year, he's an outsider trying to rid Intel of its historical resistance to change. He's also bringing fresh ideas and wholesale changes to  Intel, which promises to bring a new dynamic to the Silicon Valley institution.

IDG News Service spoke with him on a range of topics including VR headsets, IoT, autonomous cars, competitors and the decision to cut products. This is an edited version of the discussion.

IDGNS: How have you settled into your new job? What drew you to Intel?

It's been a really interesting process of acclimation. It's a great mixture of feeling, like an organization where I think my experience and my interests can really help the journey [CEO] Brian [Krzanich] wants to undertake with the company. The scale at which Intel can play is probably going to be very difficult for others to match if you look across, client, networking and the data center groups. The goal is to be able to think as one Intel.

IDGNS: There have been questions on how you would fit into Intel, which has a closed culture and history of promoting executives internally. Many people hired from external companies haven't worked out.

One thing that's really important to understand is that Intel is a company of tremendous heritage. I'm not coming in to fix anything. I'm coming in hopefully to add another dimension and an important ingredient to the management team that Brian has at his disposal. It requires me to respect what Intel has been able to achieve and the caliber of the management team and the brands assimilated. I don't think Brian hired me to maintain the status quo. I think what he wanted was a strong ingredient of outside-in thinking complementing the original thoughts. I'm feeling very comfortable now in being able to feel like I've got a good bunch of colleagues who know where I'm coming from; we can speak straight to each other and we can actually have really good discussions of meritocracy.

IDGNS: You had to make some decisions on cutting products Intel has worked on for years as the company's priorities were reset. How tough was it?

When you come into a company you have a degree of objectivity that isn't tainted by your attachments to the genesis of certain projects. For me it was a fairly structured, objective discussion where you make decisions in a transparent and open manner. As long as you can walk people through your thinking, you can take what was very controversial and make it very logical. I'm passionate about technology but I'm also passionate about profitability and how the two are married in a seamlessly reinforcing way.

IDGNS: What's the reasoning behind cutting mobile processors to focus on modems?

First of all, we rationalized what we were spending our R&D on. We had a couple of mobile SoC products that I don't think were worthy to continue to conclusion. That doesn't mean to say we're no longer doing mobile platforms. On the mobile platform side, my commitment is to talk less and do more. When we have something to say we'll talk about it.

On the modem side, it's a fundamental technology and this is where I think it comes down to being as indelible for us as our competence in CPU or GPU. We've set ourselves up with a very interesting road-map, but more importantly, we've established a degree of credibility, relevance and importance as a key technology partner with a number of key players in the industry that I think is really important.

IDGNS: What are your top priorities and goals?

I have three uber-level goals. One is to continue to drive our client computing business to a position of stable profitability in the face of a slowly declining [market]. I think we're doing well in that area. The second is to grow and scale our IoT business from something that's very interesting to something that's really substantial in the longer term. The IoT business for us is a microcosm of the entire company coming together -- we're creating a type of all-for-one, one-for-all mentality. The third is to maintain a degree of vibrancy in the technology leadership of our entire systems architecture organization. It's developing all the core technologies that really moves the competitive needle forward.

IDGNS: Intel's untethered mixed-reality headset called Project Alloy was big news at IDF. What are the expectations from Alloy and how are things going?

The whole point of having tetherless VR is a big deal. Everything we're doing in Alloy we're going to open-source. We can take VR and evolve it from the very rudimentary definitions today of [VR] in a smart phone that you clip into some kind of visor. You can move it to a capable, embedded PC that's driving two to three teraflops of computing and generate a really immersive experience. That was really it -- taking ideas out from the lab, productizing them, solving all those problems of integration, figuring out how RealSense and depth camera fits into all of that, figuring out how to do merged reality,  and saying "now go scale the ecosystem."

IDGNS: Is the VR headset the new PC?

I think it's another very interesting growth opportunity for the PC. I think it can generate a specific class of products in its own right. It will generate different segmentation points and probably a custom piece of silicon built on the PC platform that amplify the use case. So we're very excited about the whole VR space.

IDGNS: Intel hasn't given up on Moore's Law, though many believe it is reaching its end. How is Intel preparing for a future when manufacturing reaches atomic scale, and how will chips look beyond Kaby Lake?

Nobody inside Intel is coming anywhere near the kind-of-like fatalistic conclusions about where Moore's Law is. Intel has had a stellar track record in delivering node generation like clockwork. Maybe we've moved from a two-year to a two-and-a-half-year cadence, but we already see light at the end of the tunnel. We will continue to drive process technology and nobody is calling timeout on anything. We're working hard on 7-nanometer, we're talking about pathfinding for 5-nanometer. All of that is in the throes. We made a great announcement on Kaby Lake -- that's using an evolution of 14-nanometer transistor geometry that gave a substantially improved user experience compared to Skylake. We're going to continue to do more of that as we continue to drive process leadership.

IDGNS: Are you happy with your current chip line-up -- Kaby Lake for PCs, and Atom for IoT?

We have a competent portfolio of products. I'm in no way shape or form concluding they are complete and aren't going to be benefited from augmentation. For me I think it's really wanting to understand the use cases a lot more. I don't see an IoT strategy for Intel being one where everything is delivered by Intel. It's integrating a number of different technologies that could be indigenous to Intel, or could be created by other companies, but managed in a way where people could look at Intel as somebody providing the overarching framework of integration.

IDGNS: IoT is a big part of Intel's future. What's the strategy for that market?

That's a significant business. I think we're just starting. As you see the advent of autonomous driving vehicles, you see robots and drones start to ship in scale: those are very high value opportunities for us. We characterize our IoT interests into three verticals: industrial, transportation and retail -- all of them have an end-to-end dimension where we're providing a client environment, the networking infrastructure and the data analytics platform that drives all of that through industry partnerships.

IDGNS: Would in any way the ARM foundry deal help Intel achieve its goals in IoT and other areas? Would you be open to the idea of taking an ARM CPU license, as an example?

Open to? Yes. My view is fairly straightforward -- that Intel's IoT plan has to not only be able to harmoniously integrate Intel-based microprocessors and MCUs, it has to be able to aggregate and harmoniously integrate a plethora of different types of MCUs, whether it be ARM-based, MIPS-based, or proprietary MCUs. All of them have the ability to monitor, sense data that they want to get on to an information highway of some kind. Our ability to [support] many different client environments is going to be a necessity in any vertical IoT strategy we have. There are many areas in the ARM ecosystem where Intel can pragmatically play in for its own benefit. I'm a big believer in paying respect to established ecosystems.

IDGNS: Self-driving cars are a big deal for Intel. Could you talk about projects in the pipeline?

Our goal is to provide the type of computing power that dwarfs anything that exists in a car today, but basically make it mainstream. What we're doing on our Xeon Phi processor for machine learning and deep learning, what we're doing in computer vision and also supplemented by radar and lidar. Being able to aggregate that data, generate intelligence, make decisions on it with assistance from machine and deep learning algorithms -- that's all happening as we speak.

IDGNS: How do you see the autonomous car market evolving?

I see the first explosive area to be in the urban transportation environment where  services like Uber and Lyft will evolve and develop. There's going to be a lot of experimentation and path-finding to do in addition to technology creation. We're probably talking about a decade away. Stamina to invest is going to be really important;  those that have the stamina to stay the course are going to win big.

IDGNS: Nvidia is approaching the automotive markets aggressively with its GPUs, how will you compete?

I have a great deal of respect for Nvidia. But every time I think of Nvidia, I think about Californian wine where they can make great wine but it contains only one grape -- great Cabernet Sauvignon or a great Chardonnay. I love French wines and French wines are blends where you need to be great at growing Cabernet, great at growing Merlot, great at growing Cabernet Franc. The art is in the mixture. That's the benefit Intel has. We have GPU, we have CPU, we have custom silicon, we have embedded storage, we have FPGA. Nvidia's going to basically say "I've got GPUs and I've got GPUs and I've got GPUs." Great strategy, but it doesn't give anywhere near the extensibility, flexibility and scalability that Intel is able to offer.

IDGNS: How will 5G influence changes in the way devices are made and work?

5G is as much about the transformation of the network and the infrastructure as it is the client environment. [There is] going to be an even greater demand from mobile broadband bandwidth, people are going to want tens of gigabytes per second, if not hundreds of gigabytes per second. We're going to see much greater pervasiveness of client devices. If you talk about autonomous vehicles or delivering health services over a mobile network, you need to be able to make life or death decisions based on that. The network has to transform and the data center becomes a much higher order entity that's focused on massive data analytics that orchestrates that entire network.
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Wednesday, 7 September 2016

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Will IBM’s Power9 Server Chips Pose Competition to Intel’s Server Chips?

IBM’s development of its Power9 architecture has been in the news for some time, and now the company will make it available to other hardware companies by licensing its designs. Power9 chips are scheduled to come in the market in 2H17. Let’s look at some features of the new chips.

IBM’s HPC Power9 Server Chips

Intel’s x86 versus IBM’s Power9
At IDF (Intel Development Forum) 2016, IBM unveiled its Power9 server processors, built on 14nm (nanometer) FinFET (fin-shaped field effect transistor) process technology, just like Intel’s current server processors.

IBM will also integrate Xilinx’s (XLNX) FPGA (field-programmable gate array) technology in its servers, just like Intel is integrating Altera’s FPGA.

Features of Power9
IBM will launch Power9 in two basic designs: a 24 SMT4 processor and a 12 SMT8 processor.

The 24 SMT4 processor will be optimized for the Linux ecosystem and will target web service companies such as Google (GOOG), which need to run across several thousand machines. It will feature four threads.

The 12 SMT8 processor will be optimized for the PowerVM ecosystem and will target larger systems designed for running big data or AI (artificial intelligence) applications. It will feature eight threads.

Both designs will come in two models: the scale-out model will come with two CPU (central processing unit) sockets on the motherboard, and the scale-up model will come with multiple CPU sockets. The Power9 processor will have multiple connectors to attach FPGAs, GPUs (graphics processing units), and ASICs (application-specific integrated circuits).

IBM and Intel eye artificial intelligence
With all this, IBM aims to make Power9 apt for AI, cognitive computing, analytics, visual computing, and hyperscale web serving. Intel is also looking to tap AI and has recently acquired an AI startup called Nervana Systems for this reason. It has also recently developed Xeon Phi processors for deep learning applications.

IBM has changed its strategy in order to pose tough competition to Intel. We’ll look at this strategy in the next part of the series.
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Intel is acquiring Movidius, maker of compact computer vision chips: Think VR, AR, drones, robots

Intel acquiring Movidius – may be their “in” for Android over Qualcomm
This week begins with an acquisition of Movidius by Intel, the sort of acquisition that might go unnoticed by the average user. What's important about this acquisition is Movidius' work with drone obstacle avoidance sensors for DJI, heat sensor technology with FLIR, deep learning with a variety of companies - and, perhaps most importantly, the brains (the chip) that makes Google's Project Tango possible. Now Intel has announced that they're acquiring Movidius, and big things are happening behind the scenes.

HPC News

 The Movidius Vision Processing Unit was what made the first developer kits for Tango work. Google worked with Qualcomm to make ready the consumer versions of Tango technology for phones and tablets, and it seemed that Movidius disappeared from the equation. Now with Intel picking up the entirety of the company, we might be seeing another path for the company - and/or for Intel to get their big break with Android device manufacturers.

This acquisition also has a lot to do with Intel's RealSense technology.

"The ability to track, navigate, map and recognize both scenes and objects using Movidius’ low-power and high-performance SoCs opens opportunities in areas where heat, battery life and form factors are key," said Josh Walden, senior vice president and general manager of Intel’s New Technology Group.

"Specifically, we will look to deploy the technology across our efforts in augmented, virtual and merged reality (AR/VR/MR), drones, robotics, digital security cameras and beyond. Movidius’ market-leading family of computer vision SoCs complements Intel’s RealSense offerings in addition to our broader IP and product roadmap."

Movidius works with Intelligent Machine Vision for robotics, wearables, smart security, and augmented (and virtual) reality as well, so there's plenty else that Intel could have in mind for their near future. More information on how this acquisition is planned to take place can be found in the Movidius CEO post released this week.

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